HWATSING has shipped the first unit of its new 12-inch wafer thinning equipment Versatile-GH300 to a major domestic IC manufacturer, targeting advanced memory applications.

The tool integrates ultra-precision grinding with a newly designed high-rigidity structure that minimizes vibration and deformation. It delivers sub-micron accuracy and industry-leading wafer thickness uniformity.

Despite high precision, Versatile-GH300 also achieves high throughput thanks to rigid mechanics, high-speed motion control, and smart scheduling algorithms – maximizing output per hour while maintaining yield.

Its modular design supports multiple configurations and process development, flexible for both high-volume production and R&D.

This launch strengthens HWATSING’s thinning equipment portfolio and marks a key strategic move in the high-end wafer thinning market.

ICgoodFind :Versatile-GH300 brings sub-micron thinning to advanced memory. Precision and speed in one tool.